Core technology news, two years of good prospects for the semiconductor industry, this encounter is probably not small. According to The Street, the semiconductor giant Texas Instruments and Italian-French semiconductors have confirmed that part of the chip industry has been facing a cyclical pullback.

According to Nikko Industries, Japan's MLCC Major Factory, Murata, is planning to build a new factory in Okayama Prefecture at 10 billion yen ($89 million) after investing 40 billion yen to build a new plant in Shimane Prefecture late last month. The factory will be responsible for the production of ceramic materials for laminated ceramic capacitors, and Okayama and Shimane adjacent counties, may be set up for the raw materials of the Shimane plant.

Semiconductor organizations in Guangzhou, Shenzhen, Zhuhai, Hong Kong and Macau have formally joined hands to form an alliance. In the future, they will build up a synergistic semiconductor industry ecosphere with Guangdong, Hong Kong and Macao.

As supply of 12 inch silicon wafers continues to be tight, major wafer manufacturers around the world, including Japan's Shenggao, Germany's Silitronic and Universal Wafers, have begun to expand production plans. In contrast, the mainland is also accelerating the development of 12 inch large silicon wafers. According to the current planning of domestic enterprises, it is estimated that the domestic 12-inch silicon wafer production capacity will reach 1.45 million wafers per month by 2020, covering domestic demand.

Bloomberg recently reported that China's electronics giant TCL is weighing its remaining stake in Dutch semiconductor equipment manufacturer ASM International NV (ASMI) in its listed Asian subsidiary, which is facing pressure from radical investors.

Leti, A Research Institute of ST and CEA Tech, announced a collaborative effort to develop silicon-based GaN power switching module manufacturing technology. The silicon-based GaN power technology will enable Italian Semiconductors to meet high-performance, high-power applications, including hybrid and electric vehicle chargers, wireless charging and servers.

In a report at the end of August, Mosesmann, an analyst at Rosenblatt Securities Securities, said that the bottleneck for Intel's semiconductor manufacturing was not just a 10-nanonode delay, but a lot of time to solve the problem, because it would create a five-year, six-year, and six-year process disadvantage for Intel. Even seven years.

The upstream of the semiconductor industry in the fourth quarter of 2018 seems to be beginning to show off-season pressures ahead of schedule. In line with the potential further weakening of GDP growth around the world in 2019, Taiwan IC designers have recently concentrated their R&D resources in emerging automotive electronics and the Internet of Things to avoid a stall in corporate revenue and profit growth. After all, these innovative products are emerging from scratch. As long as they can grab new orders, the company's performance in the coming year is bound to increase. Taiwan IC Design Co. has begun to keep pace with the international chip factories, expanding its AI, Internet of Things and automotive power. Sub chip solutions, hoping to compete for future huge business opportunities.

In the second half of 2018, the utilization rate of the wafer plant capacity is still high-end, coupled with the client still concerned about delivery and capacity, and did not deliberately lower prices, with many new pr...

NEC Corporation announced an investment in Tascent, Inc., a U.S. -based biometric systems company, to accelerate the global expansion of its security business. The demand for further security enhancement through multimod...