NXP Semiconductors N.V., the world's largest supplier of automotive semiconductor solutions, today announced a new generation of RoadLINK solutions that extend its leadership in the field of vehicle-to-everything communications. The new NXP SAF5400 is the world's first high-performance single-chip DSRC modem with automotive standards. With a unique scalable architecture, industry-leading new security features, and advanced RF complementary metal oxide semiconductor components (RFCMOS) and Software Defined Radio (SDR) technology, OEM manufacturers offer flexible options to District deployment of security V2X and on-site upgrades.

Innodisk (Innodisk) recently released a full range of DDR4 2666 embedded memory module solutions. Including a variety of specifications and sizes, can support a new generation of Intel Core X extreme performance desktop platform, and Intel Xeon Purley server platform (Xeon Scalable series processors) and other computer systems.

AccelStor Announces New High Availability and Expandable Full Flash Memory Storage Array The NeoSapphire H710 provides flexible, flexible storage configurations for mission critical applications for enterprise users Capacity can be expanded from 27TB to 221TB.

Microsemi Corporation, a leading provider of differentiated semiconductor technology solutions for power, security, reliability and performance, today announced that its Switchtec PAX network interconnects Gen3 PCIe switching chips to provide high-performance network connectivity , For scalable multi-host systems and Just a bunch of flash (JBOF), and supports single input / output (I / O) virtualization (SR-IOV), NVMe, and multifunction endpoints.

Linghua Technology, the world's leading provider of edge computing platform, announced the launch of the new embedded fanless computer MVP-5000, which carries the sixth generation Intel Core processor, computing performance beyond the previous generation processor 30%