Both the IC and semiconductor industries have been in a positive cycle for quite some time, with the second half of 2018 and 2019 threatening to slow down or even run into turbulence. Although the next half of the market demand for many chips in the next half of 2018 remains intact, there has been some warning that the NAND Flash market is expected to fall from a shortage of capacity to a potential period of overcapacity, with time to fall in the second half of 2018 or 2019, and the DRAM price is expected to be gradually eroded.

In July 31, 2018, the global digital money miner ASIC product leader Innosilicon announced today that its bitcoin Terminator series uses Samsung's most advanced low power FinFET technology to break the industry record with ultra high energy efficiency - the energy consumption of the chip is as low as 63W/TH, and the measured wall of the mining machine is 75W/TH (25 degrees C). The record-breaking, energy-efficient ASIC has entered mass production, and the next generation of bitcoin miners using the chip has begun to ship.

Strategy Analytics mobile phone component technology research service, the latest research report, "Q1 baseband chip market share tracking in 2018: Samsung LSI over coalition" pointed out that in 2018, the Q1 global honeycomb baseband processor market increased by 0.3% to $4 billion 900 million year on year.

MLCC, chip resistance and other products of passive components, ceramic capacitors (MLCC), chip resistance and other products continue to be continued in July, and the price trend is still upward. The industry is promising. The revenue of GB and Huaxu will be synchronized for five months in July. The monthly increase rate is from two to 30%. The country is expected to exceed NT $9 billion (the same) and move towards a hundred billion. Huaxu is also expected to stand up to 5 billion yuan for the first time.

Qualcomm today said it is expected that the new apple iPhone will never use the company's baseband chip, although Qualcomm has been supplying chips for the apple "old" iPhone, but has completely lost its future business.

Samsung Electronics has previously released the 3 Nanometer Foundry process by 2020. According to the analysis, the design cost of 3 Nanometer Foundry process chip will be as high as 1 billion 500 million US dollars. Although the increase in the cost of chip design is very high, according to experts, it is said that the current efficiency and the performance increase range are not proportional to the cost, and considering the high cost, the number of enterprises that can design 3 nanoscale projects can be counted.

In recent years, NOKIA (Nokia) has actively developed various 5G related applications and also actively participates in the standard formulation to help the development of 5G connection technology in the application field of intelligent ports, car networking, intelligent factories and so on. To this end, NOKIA has introduced its own chipset to achieve the miniaturization of base stations and reduce the cost of 5G construction.

A thousand calls come out. The 3 iPhone chip supply chain, which will be launched in the second half of this year, has been fully launched last week, including a new generation of A12 application processors and 4G baseband chips, as well as other power management IC, Netcom and radio frequency IC, panel touch and drive IC and other related cores, all of which are expected to be in high volume, expected in September, according to the supply chain industry. A large number of deliveries can be delivered to the mobile assembly plant in the middle of the middle of the year.

For months, there have been rumors that Facebook wants to make chips on its own. Now, this social networking company really wants to do that. Bloomberg reported Friday that Facebook has successfully attracted a senior engineer from Google to lead Facebook's chip research.

NetEase news July 13th, according to Reuters, Intel announced on Thursday that it plans to buy a small chip maker eASIC, which will help further promote its diversification and expand beyond the CPU chip.