On the MWC2018, Huawei released the first 3GPP 5G01 commercial standard chip 5G01 (Balong 5G01) and Huawei 5G CPE (Consumer Premise Equipment) to support the worlds mainstream 5G band and theoretically achieve data downl...

Following a heavy warning from MLCC maker Murata, it announced that some of its MLCC products will be reduced by 50% in 2017 and prices will increase. Product order price increases will take effect immediately (March 2)....

Industrial Research Institute of ITRI (IEK) cited market research institutions survey report pointed out that last year the global DRAM prices soar, the output value increased by about 77%, reaching 72.5 billion US dollars, the average sales price rose 55%; this year, the pre- Estimated or in short supply, although the strength is not as good as last year's growth, but the major suppliers are still increasing their production under control. The average selling price is expected to rise more than 32% this year, and its annual output value will increase by about 23% to nearly 90 billion U.S. dollars , A new high over the years.

January 31, although the memory chip prices have dropped than in the past, but Samsung's future mobile phones and other mobile products is still strong demand. Earnings report, Samsung Electronics fourth quarter operating profit up 64% year-on-year to 15.15 trillion won (about 141.38 billion US dollars), memory contribution to profits accounted for about 2/3 of 10.2 trillion won, compared with the same period in 2016 Grow more than twice.

Broadcom unveiled its silicon-proven 7nm IP core that will power popular AI (Artificial Intelligence), 5G and high-bandwidth networking markets with Application Specific ASICs (ASICs). Broadcom to build 7-nanometer ASIC for customers to finalize the design finalized by the end of the year, Broadcom also said it will be 7 nanometer ASIC foundry and CoWoS package orders by TSMC is responsible for.

International Consumer Electronics Show CES exhibition on January 9 will be launched in Las Vegas, Taiwan digital imaging program expert Hua Jingke will be released at the CES show the latest 3D sensing depth chip AL6100, hoping to borrow by The world's largest science and technology exhibition so that the world see Huajing Branch of the technical strength and products.

Hua Hong Semiconductor Co., Ltd. today announced the successful mass production of its second-generation 90-nm G2 eFlash process platform with enhanced technical strength and competitiveness.

NXP Semiconductors N.V., the world's largest supplier of automotive semiconductor solutions, today announced a new generation of RoadLINK solutions that extend its leadership in the field of vehicle-to-everything communications. The new NXP SAF5400 is the world's first high-performance single-chip DSRC modem with automotive standards. With a unique scalable architecture, industry-leading new security features, and advanced RF complementary metal oxide semiconductor components (RFCMOS) and Software Defined Radio (SDR) technology, OEM manufacturers offer flexible options to District deployment of security V2X and on-site upgrades.

Semtech Corporation (Nasdaq: SMTC), a leading provider of high-performance analog and mixed-signal semiconductors products and advanced algorithms, today announced that Chipsafer, a startup that specializes in providing Internet of Things (IoT) services for livestock management, uses Semtech's LoRa® devices and wireless RF technology (LoRa technology) to develop its ranch solution platform. Chipsafer's sensors forward sensor data from livestock, including body movements, local humidity, temperature and location, using LoRaWAN-based gateways and LoRaWANTM protocols.

Microchip Technology Inc. today announced MPLAB ICD 4 - Microchip's online programming and debugging development tools for the PIC microcontroller and dsPIC digital signal controller family.